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[1]Ma, H. R.,Dong, C.,Zhao, N.,Wang, Y. P.,Li, X. G.,Ma, H. T.,Chen, J..Analysis and control of Cu6Sn5 preferred nucleation on single crystal (001)Cu[J],MATERIALS LETTERS,2020,265
[2]Qiao, Y. Y.,Wu, C. M. L.,Wang, Y. P.,Ma, H. T.,Zhao, N.,Liu, C. Y..Dramatic morphological reservation of prism-type Cu6Sn5 formed on single crystal Cu substrates ...[J],MATERIALS TODAY COMMUNICATIONS,2020,23
[3]Gao, Zhaoqing,Cao, Jinwei,Muzammal , Hussain Muhammad,Wang, Chen,Sun, Hao,Dong, Chong,Ma, Haitao,Wang, Yunpeng.Ultrasound assisted large scale fabrication of superhydrophilic anodized SnOx films with highly...[J],MATERIALS CHEMISTRY AND PHYSICS,2020,242
[4]Zhu, Zhidan,Ma, Haoran,Shang, Shengyan,Ma, Haitao,Wang, Yunpeng,Li, Xiaogan.Effect of polycrystalline Cu microstructures on IMC growth behavior at Sn/Cu soldering interfac...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(17):15964-15971
[5]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Ma, Haitao,Wang, Yunpeng.Geometrical effects on growth kinetics of interfacial intermetallic compounds in Sn/Cu joints r...[J],THIN SOLID FILMS,2019,669:198-207
[6]Yao, Mingjun,Zhao, Ning,Wang, Teng,Yu, Daquan,Xiao, Zhiyi,Ma, Haitao.Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Ad...[J],JOURNAL OF ELECTRONIC MATERIALS,2018,47(12):7544-7557
[7]Kunwar, Anil,Zhao, Ning,Huang, Mingliang,Ma, Haoran,Ma, Haitao,Sun, Junhao.On the increase of intermetallic compound's thickness at the cold side in liquid Sn and SnAg so...[J],MATERIALS LETTERS,2018,230:76-76
[8]Yao, Mingjun,Ma, Haitao,Xiao, Zhiyi,Yu, Daquan,Wang, Teng,Zhao, Ning.Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatt...[J],IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY,2018,8(10):1855-1862
[9]Zhong, Y.,Zhao, N.,Dong, W.,Wang, Y. P.,Ma, H. T..In situ study on the effect of Cu5Zn8 intermetallic layer on the Cu-Ni cross interaction in Cu/...[J],MATERIALS CHEMISTRY AND PHYSICS,2018,216:130-135
[10]Shang, Shengyan,Kunwar, Anil,Yao, Jinye,Wang, Yunpeng,Zhao, Ning,Huang, Mingliang,Ma, Haitao.All-round suppression of Cu6Sn5 growth in Sn/Cu joints by utilizing TiO2 nanoparticles[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(18,SI):15966-15972
[11]Shang, Shengyan,Kunwar, Anil,Wang, Yanfeng,Qi, Xiao,Ma, Haitao,Wang, Yunpeng.Synthesis of Cu@Ag core-shell nanoparticles for characterization of thermal stability and elect...[J],APPLIED PHYSICS A-MATERIALS SCIENCE & PROCESSING,2018,124(7)
[12]Ma, H. R.,Kunwar, A.,Shang, S. Y.,Jiang, C. R.,Wang, Y. P.,Ma, H. T.,Zhao, N..Evolution behavior and growth kinetics of intermetallic compounds at Sn/Cu interface during mul...[J],INTERMETALLICS,2018,96:1-12
[13]Ma, Haoran,Kunwar, Anil,Chen, Jun,Qu, Lin,Wang, Yunpeng,Song, Xueguan,Raback, Peter,Ma, Haitao,Zhao, Ning.Study of electrochemical migration based transport kinetics of metal ions in for Sn-9Zn alloy[J],MICROELECTRONICS RELIABILITY,2018,83:198-205
[14]Ma, Haoran,Kunwar, Anil,Liu, Zhiyuan,Chen, Jun,Wang, Yunpeng,Huang, Mingliang,Zhao, Ning,Ma, Haitao.Shielding effect of Ag3Sn on growth of intermetallic compounds in isothermal heating and coolin...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):4383-4390
[15]Guo, Bingfeng,Kunwar, Anil,Zhao, Ning,Chen, Jun,Wang, Yunpeng,Ma, Haitao.Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints[J],MATERIALS RESEARCH BULLETIN,2018,99:239-248
[16]Zhao, N.,Wang, M. Y.,Zhong, Y.,Ma, H. T.,Wang, Y. P.,Wong, C. P..Effect of Zn content on Cu-Ni cross-interaction in Cu/Sn-xZn/Ni micro solder joints[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(6):5064-5073
[17]Kunwar, Anil,Guo, Bingfeng,Shang, Shengyan,Raback, Peter,Wang, Yunpeng,Chen, Jun,Ma, Haitao,Song, Xueguan,Zhao, Ning.Roles of interfacial heat transfer and relative solder height on segregated growth behavior of ...[J],INTERMETALLICS,2018,93:186-196
[18]Yao, Mingjun,Zhao, Ning,Yu, Daquan,Xiao, Zhiyi,Ma, Haitao.Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesiv...[A],2018,241-246
[19]Zhao, Ning,Chen, Shi,Liu, Chunying,Zhong, Yi,Ma, Haitao,Wang, Yunpeng.Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient[A],2018,603-606
[20]马海涛,赵宁,王云鹏.Stability of multilayered Ag/Ag3Sn/Sn films noncyanide electroplateded for high-reflective back-e...[A],2018,396-399
[21]周长海,Li, XW, Wang, SH,马海涛.Magnetic effect on oxide-scale growth of Fe-5Cr alloy[A],2018,292(UNSP 012090)
[22]Kunwar Anil,Raback Peter,尚胜艳,MAlla Prafulla,宋学官,王云鹏,马海涛.A Computational Model for Simulation of Temperature during Radio-Frequency Ablation of Biological...[A],2018 IEEE International Conference on Computational Electromagnetics,2018,8496461-8496461
[23]Kunwar, Anil,Shang, Shengyan,Raback, Peter,Wang, Yunpeng,Givernaud, Julien,Chen, Jun,Ma, Haitao,Song, Xueguan,Zhao, Ning.Heat and mass transfer effects of laser soldering on growth behavior of interfacial intermetall...[J],MICROELECTRONICS RELIABILITY,2018,80:55-67
[24]Ma, Haitao,Ma, Haoran,Kunwar, Anil,Shang, Shengyan,Wang, Yunpeng,Chen, Jun,Huang, Mingliang,Zhao, Ning.Effect of initial Cu concentration on the IMC size and grain aspect ratio in Sn-xCu solders dur...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):602-613
[25]Guo, Bingfeng,Kunwar, Anil,Jiang, Chengrong,Zhao, Ning,Sun, Junhao,Chen, Jun,Wang, Yunpeng,Huang, Mingliang,Ma, Haitao.Synchrotron radiation imaging study on the rapid IMC growth of Sn-xAg solders with Cu and Ni su...[J],JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2018,29(1):589-601
[26]A. Kunwar,马浩然,马海涛,J.H. Sun,赵宁,黄明亮.Corrigendum to “On the increase of intermetallic compound's thickness at the cold side in liquid...[J],Materials Letter,2018,230:76-76
[27]Zhong, Yi,Zhao, Ning,Dong, Wei,Wang, Yunpeng,Ma, Haitao.Growth mechanism of Cu3Sn grains in the (111)Cu/Sn/Cu micro interconnects[A],2018,1748-1750
[28]Zhao, Ning,Wang, Mingyao,Zhong, Yi,Ma, Haitao,Wang, Yunpeng.Effect of Temperature Gradient on Interfacial Reactions in Cu/Sn-9Zn/Ni Solder Joints during Ag...[A],2018,1744-1747
[29]Kunwar, Anil,Shang, Shengyan,Raback, Peter,Song, Xueguan,Malla, Prafulla Bahadur,Wang, Yunpeng,Ma, Haitao.A Numerical Model for Joule heating in Sn Solder Balls of Two Different Sizes[A],2018,1329-1332
[30]Guo, Bingfeng,Huang, Ru,Yao, Jinye,Qi, Xiao,Kunwar, Anil,Wang, Yunpeng,Ma, Haitao.Effect of soldering temperature on cross-interaction at L-S interface of linear Cu/SAC305/Ni so...[A],2018,445-449
[31]Ma, Haoran,Yao, Jinye,Wang, Chen,Shang, Shengyan,Wang, Yunpeng,Ma, Haitao.Effect of Ag content on Cu6Sn5 growth behavior at Sn-Ag/Cu solder interface during multiple ref...[A],2018,441-444
[32]Ji, Shengnan,Wang, Chen,Wang, Yunpeng,Ma, Haitao,Zhao, Ning.Stability of Multilayered Ag/Ag3Sn/Sn Films Non-cyanide Electroplateded for high-reflective bac...[A],2018,396-399
[33]Qi, Xiao,Ma, Haoran,Huang, Ru,Yao, Jinye,Shang, Shengyan,Anil,Wang, Yunpeng,Ma, Haitao.Study on Electrochemical Migration of Sn-0.7Cu[A],2018,387-390
[34]Huang, Ru,Xia, Mengrou,Yao, Jinye,Wang, Boyin,Qi, Xiao,Qiao, Junshan,Ma, Haitao.Size Effect of Interfacial Reaction in Sn-0.7Cu/Cu solder under Multiple Reflow[A],2018,391-395
[35]Yao, Jinye,Li, Hua,Huang, Ru,Qi, Xiao,Wang, Boyin,Qiao, Junshan,Wang, Yunpeng,Ma, Haitao.Mechanism of Cu5Zn8 layer act as a diffusion barrier layer[A],2018,383-386
[36]Shang, Shengyan,Kunwar, Anil,Wang, Yanfeng,Yao, Jinye,Ma, Haitao,Wang, Yunpeng.Influence of Cu nanoparticles on Cu6Sn5 growth behavior at the interface of Sn/Cu solder joints[A],2018,135-140
[37]Zhong, Y.,Zhao, N.,Liu, C. Y.,Dong, W.,Qiao, Y. Y.,Wang, Y. P.,Ma, H. T..Continuous epitaxial growth of extremely strong Cu6Sn5 textures at liquid-Sn/(111)Cu interface ...[J],APPLIED PHYSICS LETTERS,2017,111(22)
[38]Ma, Haoran,Kunwar, Anil,Huang, Ru,Chen, Jun,Wang, Yunpeng,Zhao, Ning,Ma, Haitao.Size effect on IMC growth induced by Cu concentration gradient and pinning of Ag3Sn particles d...[J],INTERMETALLICS,2017,90:90-96
[39]Ma, Haoran,Wang, Yunpeng,Chen, Jun,Kunwar, Anil,Ma, Haitao,Zhao, Ning.Geometrical outline evolution and size-inhibiting interaction of interfacial solder bubbles and...[J],VACUUM,2017,145:103-111
[40]Zhao, Ning,Deng, Jianfeng,Zhong, Yi,Ma, Haitao,Wang, Yunpeng,Wong, Ching-ping.Effect of Zn content on interfacial reactions of Ni/Sn-xZn/Ni joints under temperature gradient[J],JOURNAL OF MATERIALS RESEARCH,2017,32(18):3555-3563
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