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[1]Zhao, Linjie.Surface roughness measurement accuracy analysis of grinded silicon wafer by white light scannin...[A],OPTICAL MEASUREMENT SYSTEMS FOR INDUSTRIAL INSPECTION XI,2022,11056
[2]兰天.基于等效泄漏间隙的不同密封结构泄漏率分析[J],现代机械,2022,4:63-67
[3]郭民政.大面积液浮平面电极稳定性分析[J],现代机械,2022,4:16-20
[4]白倩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163
[5]闫英.P SD法在超精密加工质量评价中的应用[J],实验室科学,2018,21(4):11-14
[6]左云盛.Cu2+浓度对于铜电致化学抛光过程的影响[A],2016年全国电化学加工技术研讨会,2016,7-12
[7]兰天.一种基于等效平行间隙的静密封漏率预测方法[J],润滑与密封,2020,45(3):102-106
[8]Wu, Juanjuan.Enhanced Mass Transfer and Improved Catalyst Recovery in a Stirred Reactor by Polymeric Ionic L...[J],ADVANCED MATERIALS TECHNOLOGIES,2019,4(2)
[9]武娟娟.Enhanced Mass Transfer and Improved Catalyst Recovery in a Stirred Reactor by Polymeric Ionic Liq...[J],Advanced Materials Technologies,2018,4(2):1800515-
[10]Zhang, Chunyang.Efficient stable graphene-based perovskite solar cells with high flexibility in device assembli...[J],Energy Environmental Science,2019,12(12):3585-3594
[11]Huang, Ning.Elastic recovery of monocrystalline silicon during ultra-fine rotational grinding[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2021,65:64-71
[12]Pan, Yuhang.Activation functions selection for BP neural network model of ground surface roughness[J],JOURNAL OF INTELLIGENT MANUFACTURING,2021,31(8):1825-1836
[13]Wang, Ke.Preparation of Flat and Smooth Copper Surface by Jet Electrochemical Machining and Electrochemi...[J],JOURNAL OF THE ELECTROCHEMICAL SOCIETY,2021,167(16)
[14]兰天,周平,闫英.基于等效泄漏间隙的不同密封结构泄漏率分析[J],现代机械,2019,4:63-67
[15]郭民政,周平,闫英,郭东明.大面积液浮平面电极稳定性分析[J],现代机械,2019,4:16-20
[16]Wang, Lin,Zhou, Ping,Yan, Ying,Kang, Renke,Guo, Dongming.Physically-based modeling of pad-asperity scale chemical-mechanical synergy in chemical mechani...[J],TRIBOLOGY INTERNATIONAL,2019,138:307-315
[17]Yan, Ying,Wang, Yonghao,Zhou, Ping,Huang, Ning,Guo, Dongming.Near-field microscopy inspection of nano scratch defects on the monocrystalline silicon surface[J],PRECISION ENGINEERING-JOURNAL OF THE INTERNATIONAL SOCIETIES FOR PRECISION ENGINEERING AND NANOTECHNOLOGY,2019,56:506-512
[18]Shao, Yingying,Zhang, Chunyang,Wang, Shi,Yan, Ying,Feng, Yulin,Bian, Jiming,Shi, Yantao.Insight into the Interfacial Elastic Contact in Stacking Perovskite Solar Cells[J],ADVANCED MATERIALS INTERFACES,2019,6(7)
[19]Ding, Yunzhe,Yan, Ying,Wang, Hanwen,Wang, Xinkui,Hu, Tao,Tao, Shengyang,Li, Guangtao.Preparation of Hollow Cu and CuOx, Microspheres with a Hierarchical Structure for Heterogeneous...[J],ACS APPLIED MATERIALS & INTERFACES,2018,10(48):41793-41801
[20]闫英,周平,郭晓光,王一奇,白倩,司立坤.P SD法在超精密加工质量评价中的应用[J],实验室科学,2018,21(4):11-14
[21]Li, Yan,Yan, Ying,Duan, Fuhai,Fan, Liang.Static error model of a three-floated gyroscope with a rotor supported on gas-lubricated bearin...[J],PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART C-JOURNAL OF MECHANICAL ENGINEERING SCIENCE,2018,232(16):2850-2860
[22]Wang, Shi,Shi, Yantao,Zhang, Chunyang,Feng, Yulin,Shao, Yingying,Yan, Ying,Dong, Qingshun,Liu, Junxue,Hu, Beichen,Jin, Shengye.High-air-flow-velocity assisted intermediate phase engineering for controlled crystallization o...[J],JOURNAL OF MATERIALS CHEMISTRY A,2018,6(19):8860-8867
[23]白倩,董志刚,闫英,高尚,朱祥龙,段春争,刘冲,崔岩.金属增减材复合制造专业硕士实践教学平台建设[J],实验室科学,2018,21(2):158-160,163
[24]司立坤,周平,闫英,马建伟,崔岩.慕课在机械精度实验课中的应用[J],实验室科学,2018,21(1):130-132
[25]闫英,周平,郭晓光,王一奇,白倩,司立坤.PSD法在超精密加工质量评价中的应用[J],实验室科学,2018
[26]Yan, Y.,Guo, D.,Wen, S. Z..Dielectrophoretic effect on droplet dynamic behaviors in microchannels[J],MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS,2017,23(10):4841-4851
[27]Yan, Ying,Guo, Dan,Wen, Shizhu.Joule Heating Effects on Two-phase Flows in Dielectrophoresis Microchips[J],BIOCHIP JOURNAL,2017,11(3):196-205
[28]Wang, Lin,Zhou, Ping,Yan, Ying,Zhang, Bi,Kang, Renke,Guo, Dongming.Chemical-mechanical wear of monocrystalline silicon by a single pad asperity[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2017,120:61-71
[29]Zhou, Ping,Yan, Ying,Huang, Ning,Kang, Renke,Guo, Dongming,Wang, Ziguang.Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding[J],JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING-TRANSACTIONS OF THE ASME,2017,139(8)
[30]周平,闫英,康仁科,郭东明.Nonlinear Compression Behavior of the Grooved Polishing Pad: AModel and Its Validation[J],ECS Journal of Solid State Science and Technology,2017
[31]左云盛,闫英,周平,王可,郭民政.Cu~((2+))浓度对于铜电致化学抛光过程的影响[A],2016年全国电化学加工技术研讨会,2016,6
[32]Zhou, Ping,Xu, Shance,Wang, Ziguang,Yan, Ying,Kang, Renke,Guo, Dongming.A load identification method for the grinding damage induced stress (GDIS) distribution in sili...[J],INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE,2016,107:1-7
[33]Zhang, Hongyu,Yan, Ying,Gu, Zhibin,Wang, Yi,Sun, Tao.Friction Enhancement between Microscopically Patterned Polydimethylsiloxane and Rabbit Small In...[J],ACS BIOMATERIALS SCIENCE & ENGINEERING,2016,2(6):900-907
[34]Yan Ying, Wen S Z, Luo J, Guo D*,Yan Y.Dynamic Dielectrophoresis Model of Multi-phase Ionic Liquids,PLOS ONE,2015,10(2): e0117456,2019
[35]Layer-dependent Anisotropic Frictional Behavior in Two-dimensional Monolayer Hybrid Perovskite/IT...[J],Physical Chemistry Chemical Physics,2019
[36]Enhanced Mass Transfer and Improved Catalyst Recovery in a Stirred Reactor by Polymeric Ionic Liq...[J],Advanced Materials Technologies,2019,2018:1800515
[37]Layer-dependent anisotropic frictional behavior in two-dimensional monolayer hybrid perovskite/IT...[J],Physical Chemistry Chemical Physics,2019,2019,21(5):2540-2546
[38]Effect of cupric ion concentration on the etching behavior of copper in Electrogenerated Chemical...[J],Precision Engineering,2019,2019, 55:70-76
[39]Direct 3D Printing of Reactive Agitating Impellers for the Convenient Treatment of Various Pollut...[J],Advanced Materials Interfaces,2019,2018, 5(8):1701626
[40]Analytical analysis of the grain depth-of-cut in the ultrafine rotational grinding of silicon waf...[J],Journal of Manufacturing Science and Engineering,2019,2018,140:121001-10
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