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Yun Chen, Liyi Li, Cheng Zhang, Chia-Chi Tuan, Xin Chen*, Jian Gao, and Ching-Ping Wong*. Controlling Kink Geometry in Nanowires Fabricated by Alternating Metal-Assisted Chemical Etching. Nano Letters, 2017. 17(2): 1014–1019. (IF=13.779，SCI 1区，Top 期刊)
Yun Chen, Cheng Zhang, Liyi Li, C.C.Tuan, F. Wu, Xin Chen*, Jian Gao, Y. Ding, and Ching-Ping Wong*, Fabricating and controlling silicon zigzag nanowires by diffusion-controlled metal-assisted chemical etching method. Nano Letters,2017.17(7):4304-4310 (IF=13.779，SCI 1区，Top 期刊)
Yun Chen, Yicheng Kuang, Dachuang Shi, Maoxiang Hou, Xin Chen*, Lelun Jiang, Jian Gao, Lanyu Zhang, Yunbo He, Ching-Ping Wong*, A triboelectric nanogenerator design for harvesting environmental mechanical energy from water mist, Nano Energy, 2020,73,104765 (IF= 16.602，SCI 1区，Top 期刊)
Yun Chen, Cheng Zhang, Liyi Li, Shuang Zhou, Xin Chen*, Jian Gao, Ni Zhao*, Ching-Ping Wong*, Hybrid Anodic and Metal-assisted Chemical Etching Method Enabling Fabrication of Silicon Carbide Nanowires, SMALL,2019,15(7), e1803898. (IF= 11.459，SCI 1区，Top 期刊)
Yun Chen, Junyu Long, Shuang Zhou, Dachuang Shi, Yan Huang, Xin Chen*, Jian Gao, Ni Zhao*, Ching-Ping Wong*, UV Laser-induced polyimide-to-graphene conversion: modeling, fabrication and application, SMALL METHODS, 2019(3):1900208 (IF=12.13，SCI 1区)
Dachuang Shi, Yun Chen*, Xun Chen, Xin Chen, Jian Gao, Yunbo He, Chingping Wong*. Ladder-like tapered pillars enabling spontaneous and consecutive liquid transport. ACS Applied Materials & Interfaces, 2018,10(40):34735-34743. (IF= 8.758，SCI 1区，Top 期刊)
Dachuang Shi#, Yun Chen#*, Yao Yao, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, Guoping Zhang, Chingping Wong*. Ladderlike Conical Micropillars Facilitating Underwater Gas-Bubble Manipulation in an Aqueous Environment. ACS Applied Materials & Interfaces, 2020,12(37):42437-42445. (IF= 8.758，SCI 1区，Top 期刊)
Yun Chen, Han-xiong Li, Xiuyang Shan, Jian Gao, Xin Chen, Fuliang Wang. Ultrasound Aided Smooth Dispensing for High Viscoelastic Epoxy in Microelectronic Packaging. Ultrasonics Sonochemistry, 2016(28):15-20.(IF= 7.279，SCI 2区)
Yun Chen, Dachuang Shi, Yanhui Chen, Xun Chen*, Jian Gao, Ni Zhao* and Ching-Ping Wong*, A facile, low-cost plasma etching method for achieving size controlled non-close-packed monolayer arrays of polystyrene nano-spheres, Nanomaterials.2019, 9, 605. (IF= 4.034，SCI 2区)
Yun Chen, Shuquan Ding, Junyu Long, Maoxiang Hou, Xin Chen, Jian Gao, Yunbo He, and Ching-Ping Wong, Rationally designing the trace of wire bonder head for large-span-ratio wire bonding in 3D stacked packaging, IEEE ACCESS, 2020, 8, 206571-206580. (IF= 4.098, SCI 2区)
Yun Chen, Dachuang Shi, Xiquan Mai, Liyi Li, Jian Gao, Xin Chen*, Han-Xiong Li, Ching-Ping Wong*. Design and fabrication of inverted tapered micro-pillars for spontaneously transporting liquid upward. Microfluidics and Nanofluidics, 2018,22(1):9.(IF=2.437，SCI 2区)
Yun Chen, Cheng Zhang, Liyi Li, Chia-Chi Tuan, Xin Chen*, Jian Gao, Yunbo He, Ching-Ping Wong*, Effects of defects on the mechanical properties of kinked silicon nanowires, Nanoscale Research Letter, 2017.12(1):185. (IF=3.159，SCI 2区)
Yun Chen, Wang F, Han-xiong Li. Experimental and Modeling Study of Breakup Behavior in Silicone Jet Dispensing for Light-Emitting Diode Packaging. IEEE Transactions on Components, Packaging and Manufacturing Technology, 2015,5(7):1019-1026. (IF=1.86)
Yun Chen, Fuliang Wang. Comparison of Fundamental Frequency and Sweep Resistance of Different WireLoops Using Finite Element Model, International Journal of Structural Stability and Dynamics, 2015, 15(1):1450032. (IF= 2.156)
Jian Wang, Shengzhu Yi, Zhilun Yang, Yun Chen*, Lelun Jiang*, Ching-Ping Wong, Laser Direct Structuring of Bioinspired Spine with Backward Micro-barbs and Hierarchical Microchannels for Ultrafast Water Transport and Efficient Fog Harvesting, ACS Applied Materials & Interfaces, 2020,12(18):21080-21087. (IF=8.758，SCI 1区，Top 期刊)
Yan Huang, Yun Chen, Xiangyu Fan, Ningqi Luo, Shuang Zhou, Shih-Chi Chen, Ni Zhao*, Ching-Ping Wong*. Wood Derived Composites for High Sensitivity and Wide Linear-Range Pressure Sensing. Small, 2018,14(31):1801520. (IF= 11.459，SCI 1区，Top 期刊)
Fuliang Wang, Yun Chen, Lei Han. Ultrasonic vibration at thermosonic flip-chip bondinginterface, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2011, 1(6):852-858. (IF=1.86)
Fuliang Wang, Yun Chen, Lei Han. Effect of capillary trace on dynamic loop profile evolution in thermosonic wire bonding, IEEE Transactions on Components, Packaging and Manufacturing Technology, 2012, 2(9):1550-1557. (IF=1.86)
Fuliang Wang, Yun Chen, Lei Han. Modeling of deep cavity looping process on 3-D stacked die package, IEEE Transactions on Semiconductor Manufacturing, 2013, 26(1):169-175.(IF= 1.336)
Fuliang Wang, Yun Chen, Lei Han. Investigation of complex looping process for thermosonic wire bonding, IEEE Transactions on Semiconductor Manufacturing, 2014, 27(2):238-245.(IF= 1.336)
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