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J.Q. Chen, J.D. Guo, K.L. Liu, J.K. Shang, Dependence of electromigration damage on Sn grain orientation in Sn-Ag-Cu solder joints, J. Appl. Phys., 114: 15 (2013) 153509
H.F. Zhou, J.D. Guo, Q.S. Zhu, J.K. Shang, Application of Electroless Fe-42Ni(P) Film for Under-bump Metallization on Solder Joint, Journal of Materials Science & Technology 29:1 (2013) 7-12.
H.F. Zhou, J.D. Guo, J.K. Shang, Electroless Deposition of Highly Solderable Fe-Ni Films. Journal of the Electrochemical Society 160: 6 (2013) D233-D239.
H.Y. Liu, Q.S. Zhu, Z.G. Wang, J.D. Guo, J.K. Shang, Effects of Zn addition on electromigration behavior of Sn-1Ag-0.5Cu solder interconnect. Journal of Materials Science-Materials in Electronics, 24: 1 (2013) 211-216.
H.F. Zhou, J.D. Guo, J.K. Shang, Microstructural Study of Interfacial Reactions between Liquid Sn and Electroless Fe-Ni Alloys, J. Electron. Mater., 41：11，(2012), 3161-3168.
X.F. Zhang, H.Y. Liu, J.D. Guo, J.K. Shang, Inhibition of electromigration in eutectic SnBi solder interconnect by plastic prestraining, J. Mater. Sci. Tech., 27:11, (2011), 1072-1076.
X.F. Zhang, J.D. Guo, J.K. Shang, Current-Induced Interfacial Reactions in Sn Solder Joints with Electroplated FeNi/Cu Substrate, J. Electron. Mater., 39:3 (2010) 333–337.
X.F. Zhang, J.D. Guo, J.K. Shang, Growth kinetics of intermetallic compounds between Sn–9Zn solder and electroplated Fe–42Ni metallization, J. Alloy Comp., 487 (2009) 776–780.
Q.L. Yang, P. J. Shang, J.D. Guo, Z. Q. Liu, J.K. Shang, Current-induced growth of P-rich phase at electroless nickel/Sn interface, J. Mater. Res., 24:9 (2009) 2767-2774.
X.F. Zhang, J.D. Guo, J.K. Shang，Effects of electromigration on interfacial reactions in the Ni/Sn-Zn/Cu solder interconnect, J. Electron. Mater., 38:3. (2009). 425-429.
X.G. Chen, G.H. He, J.H. Du, S.F. Pei, J.D. Guo, Investigation on the thermal conductivity of HDPE/MWCNT composites by laser pulse method, Science in china series E, 52:9, (2009)2767-2772.
X.F. Zhang, J.D. Guo, J.K. Shang，Controlling intermetallic compound formation reaction between Sn and Ni-P by Zn addition, J. Alloy Comp., 479 (2009), 505-510.
X.N. Du, J.D. Guo, J.K. Shang, Effect of Electromigration on Interfacial Reactions in 90Sn-10Sb Pb-Free Solder Joints, J. Electron. Mater., 38:11 (2009) 2398–2404。
H.Y. Guo, J.D. Guo, J.K. Shang, Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces, J. Electron. Mater., 38:12 (2009) 2470–2478.
X.F. Zhang, J.D. Guo, J.K. Shang，Reverse polarity effect from effective charge disparity during electromigration in eutectic Sn-Zn solder interconnect, J. Mater. Res. 23 (2008), 3370-3378.
X.N. Du, S.M. Yin, S.C. Liu, B.Q. Wang, J.D. Guo, Effect of the electropulsing on mechanical properties and microstructure of an ECAPed AZ31 Mg alloy, J. Mater. Res., 23:6 (2008) 1570-1577.
X.Y. Wu, J.D. Guo, Electric-discharge compaction of graded WC–Co composites, Inter. J. Refract. Met. & Hard Mater. 26 (2008) 28–32.
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