张广平 - 中国科学院金属研究所 - 沈阳先进材料研究发展中心

研究领域

微/纳米尺度材料及其力学行为；层状材料及其力学性能；先进材料的疲劳与断裂行为。

近期论文

查看导师最新文章（温馨提示：请注意重名现象，建议点开原文通过作者单位确认）

H.S. Liu, B. Zhang, G. P. Zhang, Enhanced toughness and fatigue properties of cold roll-bonded Cu/Cu laminated composites with mechanical contrast, Scripta Mater. 65 (2011) pp. 891-894. M. Wang, B. Zhang, G.P. Zhang, C.S. Liu, Scaling of reliability of gold interconnect lines subjected to alternating current, Appl. Phys. Lett. 99 (2011) 011910. Y. P. Li, G. P. Zhang, On plasticity and fracture of nanostructured Cu/X (X = Au, Cr) multilayers: The effects of length scale and interface/boundary. Acta Mater. 58 (2010) pp. 3877-3887. X. F. Zhu, Y. P. Li, G. P. Zhang, J. Tan, Y. Liu, Understanding nanoscale damage at a crack tip of multilayered metallic composites. Appl. Phys. Lett. 92 (2008) pp.161905-1~161905-3. Y. P. Li, G. P. Zhang, J. Tan and B. Wu, Direct observation of dislocation plasticity in 100 nm scale Au/Cu multilayers. Appl. Phys. Lett. 91 (2007) pp.061912-1-061912-3.