The planar structure of thin-film piezoelectric resonators limits the integration of multiband processors on a single chip. A three-dimensional nanomechanical resonator based on conformal ferroelectric gates to excite resonance in scalable silicon fins is shown to enable multiband integration on a single chip and to facilitate densification of processors for ultrawide-band wireless communication.

中文翻译：

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用于大规模可扩展频谱处理器的三维声学谐振器

薄膜压电谐振器的平面结构限制了多频带处理器在单个芯片上的集成。三维纳米机械谐振器基于共形铁电栅极，可在可扩展的硅鳍中激发谐振，可在单个芯片上实现多频带集成，并促进超宽带无线通信处理器的致密化。